Global trends: market drivers, emerging applications, intellectual property factors, government policy effects, roadmap review and development.
Business aspects: competitive and market dynamics, “pure play” foundries vs. platform-based design approaches, technology transfer, IDM vs. fabless approaches, supply chain challenges, ecosystem development, cost management and reduction, market research and intelligence, product and service positioning.
Technology aspects: process selection and development, PDKs and design rules, design for manufacturing, scaling, yield improvement, IP blocks, rapid prototyping, high volume production.
Emerging technologies and processes: TSVs, 3D stacking, wafer level packaging, CMOS MEMS integration, EDA software and simulation tools, polymer and glass microfabrication, novel materials and coatings, lamination techniques, ultra-thin and flexible substrates.
Front-end production: equipment, tools, methodologies, case studies.
Testing and reliability: equipment, tools, methodologies, case studies.
Packaging: equipment, tools, methodologies, case studies.
To ensure a more exclusive and intimate networking environment for both the exhibitors and the attendees, the exhibits will only be open to conference attendees.