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Event Overview:

The SMTA and Chip Scale Review are pleased to announce plans for the 13th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

Here are some of the conference and expo highlights from 2015:
650 attendees
65 exhibiting companies with 195 booth staff in attendance
16 countries represented
43 technical papers

Each year, IWLPC's venue in the heart of Silicon Valley also provides attendees with a great opportunity to network and meet with industry experts. We look forward to another successful conference next year and are actively looking for interested experts to participate in the technical committees. Each year, it is our key contributors who maintain the high technical quality of the presentations with which IWLPC has become synonymous.

Exhibitor Information:

Why Exhibit at IWLPC?
- Reach a focused international audience
- Generate Exposure in this highly competitive marketplace
- Share New Products and concepts to the market
- Enhance Relationships with existing customers and generate new leads

About SMTA:

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

About Chip Scale Review:

Chip Scale Review is the leading global magazine going into its 18th year covering device and wafer-level test, assembly, and packaging. While holding true to its founding mission, as packaging has evolved, so too has Chip Scale Review, which now also covers high-density interconnection technologies including 3D packages, MEMS, and other wafer-fabricated devices. We are proud to be part of an industry that has been responsible for many of the major technological breakthroughs since the “birth” of the integrated circuit.

Contact the event managers listed below for more information about how you can participate at the IWLPC 2016 - International Wafer-Level Packaging Conference.

All information in Events In America is deemed to be accurate at the time we add it, and we take steps to verify all details and update our records when new information is provided, but as people, events and circumstances change, we caution users to independently confirm all information. and Events In America LLC make no guarantee of accuracy and assume no liability for inaccurate information.

Conference/Event Dates: 10/18/2016 - 10/20/2016
Expo/Exhibit Dates: 10/18/2016 - 10/19/2016
Classification: B2B
Primary Industry: Technology
Other Industries: Associations: Trade / Professional, Business, Engineering, Manufacturing, Packaging, Technology
Estimated Attendance: 700
Audience: Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
Venue: DoubleTree by Hilton Hotel San Jose
Venue Phone: (408) 453-4000
Venue Type: Indoor - Hotel
Official Conference Hotel:DoubleTree by Hilton Hotel San Jose
Conference Hotel URL:
Number of Exhibitors:65 (2015) (Previous Year)
Show Owner:Surface Mount Technology Association (SMTA) and Chip Scale Review
Show Manager:Surface Mount Technology Association (SMTA) and Chip Scale Review
Sponsorship: Yes

Booth Size Booth Cost   Available Amenities
8' x 10' $1,500 SMTA Member; $1,700 Non-Member   Electricity: Yes - Unknown Price
6' Table Top $1,100 SMTA Member; $1,300 Non-Member   Water: n/a
  Generator: n/a
  Marketing Vehicles Allowed: Call
Other Booth Sizes Available: n/a

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IWLPC 2016 - International Wafer-Level Packaging Conference

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