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EVENT DATES
Oct 2015
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EXHIBITION HALL DATES
Oct 2015
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262728293031 

Venue

DoubleTree by Hilton Hotel San Jose 2050 Gateway Place San Jose , California 95110
Tel: (408) 453-4000
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IWLPC 2015 - International Wafer-Level Packaging Conference

Overview

Event Overview:

SMTA and Chip Scale Review are pleased to announce the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Exhibitor Information:

Why Exhibit at IWLPC?
Reach a focused international audience
Generate Exposure in this highly competitive marketplace
Share New Products and concepts to the market
Enhance Relationships with existing customers and generate new leads 

About the SMTA:

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. 

About CSR:

Chip Scale Review is the leading global magazine going into its 18th year covering device and wafer-level test, assembly, and packaging. While holding true to its founding mission, as packaging has evolved, so too has Chip Scale Review, which now also covers high-density interconnection technologies including 3D packages, MEMS, and other wafer-fabricated devices. We are proud to be part of an industry that has been responsible for many of the major technological breakthroughs since the “birth” of the integrated circuit.

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