San Jose , CA 95110 Location map
DoubleTree by Hilton Hotel San Jose
IWLPC 2015 - International Wafer-Level Packaging Conference
SMTA and Chip Scale Review are pleased to announce the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Why Exhibit at IWLPC?
* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
About the SMTA:
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Chip Scale Review is the leading global magazine going into its 18th year covering device and wafer-level test, assembly, and packaging. While holding true to its founding mission, as packaging has evolved, so too has Chip Scale Review, which now also covers high-density interconnection technologies including 3D packages, MEMS, and other wafer-fabricated devices. We are proud to be part of an industry that has been responsible for many of the major technological breakthroughs since the “birth” of the integrated circuit.
Don't wait to register for the IWLPC 2015 - International Wafer-Level Packaging Conference. You'll meet influential people and maximize your opportunities for success. Start now by accessing the information below.
5200 Willson Road, Suite 215
Edina, MN 55424
The overall attendance of 720 technologists from 19 countries in 2014 grew nearly 26% more attendees than the 2013 event.
SMTA and Chip Scale Review
Exhibitor Information +