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Event Overview:

SMTA and Chip Scale Review are pleased to announce the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Exhibitor Information:

Why Exhibit at IWLPC?
Reach a focused international audience
Generate Exposure in this highly competitive marketplace
Share New Products and concepts to the market
Enhance Relationships with existing customers and generate new leads 

About the SMTA:

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. 

About CSR:

Chip Scale Review is the leading global magazine going into its 18th year covering device and wafer-level test, assembly, and packaging. While holding true to its founding mission, as packaging has evolved, so too has Chip Scale Review, which now also covers high-density interconnection technologies including 3D packages, MEMS, and other wafer-fabricated devices. We are proud to be part of an industry that has been responsible for many of the major technological breakthroughs since the “birth” of the integrated circuit.

Don't wait to register for the IWLPC 2015 - International Wafer-Level Packaging Conference. You'll meet influential people and maximize your opportunities for success. Start now by accessing the information below.

All information in Events In America is deemed to be accurate at the time we add it, and we take steps to verify all details and update our records when new information is provided, but as people, events and circumstances change, we caution users to independently confirm all information. and Events In America LLC make no guarantee of accuracy and assume no liability for inaccurate information.

Conference/Event Dates: 10/13/2015 - 10/15/2015
Expo/Exhibit Dates: 10/14/2015 - 10/15/2015
Expo/Exhibit Hours: Wed, 10am-5:30pm, Exhibitor Reception, 5:30-7pm; Thurs, 10am-3:30pm
Classification: B2B
Primary Industry: Technology
Other Industries: Associations: Trade / Professional, Business, Manufacturing, Technology
Estimated Attendance: 700
Cost to Attend:
Audience: Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
Notes: The overall attendance of 720 technologists from 19 countries in 2014 grew nearly 26% more attendees than the 2013 event.
Venue: DoubleTree by Hilton Hotel San Jose
Venue Phone: (408) 453-4000
Venue Type: Indoor - Hotel
Official Conference Hotel:DoubleTree by Hilton Hotel San Jose
Conference Hotel URL:
Number of Exhibitors:46 Booths, 22 Table Tops (58 Companies in 2014)
Exhibit Floorplan PDF:Download Exhibit Floorplan PDF
Show Owner:SMTA and Chip Scale Review
Show Manager:Tricord Tradeshow Services
Sponsorship: Yes
Sponsorship Details:

Booth Size Booth Cost   Available Amenities
8' x 10' On/Before July 8th $1,300 SMTA Member; $1,500 Non-member   Electricity: Yes Standard Electricity (500w) Included in the booth fee.
6' Table Top On/Before July 8th $900 SMTA Member; $1,100 Non-member   Water: n/a
After July 8th costs increase by $200   Generator: n/a
  Marketing Vehicles Allowed: Call
Other Booth Sizes Available: n/a

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IWLPC 2015 - International Wafer-Level Packaging Conference

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