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SMTA and Chip Scale Review are pleased to announce the 10th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.


Why Exhibit at IWLPC?
Reach a focused international audience
Generate Exposure in this highly competitive marketplace
Share New Products and concepts to the market
Enhance Relationships with existing customers and generate new leads 

About SMTA:

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

About the Chip Scale Review:

The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century.

Not sure if you want to exhibit at or attend the IWLPC 2013 - International Wafer-Level Packaging Conference? See the panels below to get the information you need to make an informed decision.

All information in Events In America is deemed to be accurate at the time we add it, and we take steps to verify all details and update our records when new information is provided, but as people, events and circumstances change, we caution users to independently confirm all information. and Events In America LLC make no guarantee of accuracy and assume no liability for inaccurate information.

Conference/Event Dates: 11/05/2013 - 11/07/2013
Expo/Exhibit Dates: 11/06/2013 - 11/07/2013
Expo/Exhibit Hours: Wed, 10am-5:30pm; Thurs, 10am-1:30pm
First Move-In Date: 11/05/2013
Classification: B2B
Primary Industry: Engineering
Other Industries: Business, Engineering, Manufacturing, Packaging, Technology
Audience: Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
Venue: DoubleTree by Hilton Hotel San Jose
Venue Phone: (408) 453-4000
Venue Type: Indoor - Hotel
Official Conference Hotel:DoubleTree by Hilton Hotel San Jose
Conference Hotel URL:
Exhibit Floorplan PDF:Download Exhibit Floorplan PDF
Show Owner:SMTA & Chip Scale Review
Sponsorship: Yes
Sponsorship Details: Command the Attention of the IC Packaging Community!
Become a sponsor of the International Wafer-Level Packaging Conference

Our broad range of sponsorship opportunities are a great way to maximize your company's exposure at the IWLPC and in the advanced packaging industry.

Email your completed form to: Kim Newman at Chip Scale Review or fax to 408-429-8605
Questions? Contact Kim Newman at 408-429-8585

Booth Size Booth Cost   Available Amenities
One Table - Member $1,100   Electricity: Yes $50
Two Tables - Member $2,200   Water: n/a
One Table - Non Member $1,250   Generator: n/a
Two Tables - Non Member $2,500   Marketing Vehicles Allowed: n/a
Other Booth Sizes Available: n/a

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IWLPC 2013 - International Wafer-Level Packaging Conference

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