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The workshop will feature visionary talks by leaders from academia, industry and the government that will help identify themes for future InterPACK conferences. It will also include sessions that cover fundamental building blocks in micro-systems packaging such as materials, thermals, reliability and mechanics among others. These sessions will be juxtaposed with sessions that discuss applications in systems that cover the spectrum from IOT and wearable devices, automotive systems to high performance computers and data centers that enable next generation computing needs for diverse applications including bio-medical computation to weather prediction. The workshop will feature engaging panels where experts from industry and academia will engage with the workshop invitees to help define the structure of future InterPACK themes.
InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of Micro-electronic packaging, Photonics, MEMS and NEMS. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The InterPACK Conference Series was founded in 1992, by Professor Avi Bar Cohen, as the ASME-JSME Joint Electronic Packaging Conference. It was renamed InterPACK in 1995, and has been occurring biannually since then. InterPACK grateful for the continued co-sponsorship of The Japan Society of Mechanical Engineers (JSME) from the beginning of the InterPACK series.
Attendees to the InterPACK Workshop can access the inaugural IoT Connect: Intelligent Hardware Conference and the 25th annual Information Storage and Processing Systems Conference at no additional cost.
ASME is a not-for-profit membership organization that enables collaboration, knowledge sharing, career enrichment, and skills development across all engineering disciplines, toward a goal of helping the global engineering community develop solutions to benefit lives and livelihoods. Founded in 1880 by a small group of leading industrialists, ASME has grown through the decades to include more than 140,000 members in 151 countries.
Co-located with IoT Connect and ISPS.
There may be many networking opportunities at the IPW InterPack Workshop. Find out more in the event details below.
|Conference/Event Dates:||06/20/2016 - 06/21/2016|
|Other Industries:||Business, Manufacturing, Manufacturing - General, Packaging|
|Cost to Attend:||https://www.asme.org/events/ipw/register...|
|Venue:||Santa Clara Marriott|
|Venue Phone:||(408) 988-1500|
|Venue Type:||Indoor - Hotel|
|Official Conference Hotel:||Santa Clara Marriott|
|Conference Hotel URL:||http://www.marriott.com/hotels/travel/sjcga-santa-clara-marriott/...|
|Show Owner:||American Society of Mechanical Engineers (ASME)|
|Booth Size||Booth Cost||Available Amenities|
|Call for information.||Electricity:||n/a|
|Marketing Vehicles Allowed:||Call|
|Other Booth Sizes Available: n/a|
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