The 47th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The Annual IMAPS Symposium attracts approximately 1,200 attendees who represent all facets of the microelectronics and electronic packaging industries. These include: engineers, technicians, R&D, purchasing, manufacturing, management, and many more. They represent the automotive, communications, medical, aerospace, computer, defense, homeland security and consumer industries.
The International Microelectronics Assembly and Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions bringing together the entire microelectronics supply chain. Our events and products focus on those technologies critical to the present and future of microelectronics: 3D Integration, MEMS, Flip Chip, Wafer Level Packaging, Thermal Management, Printed Electronics, Advanced Materials, Photonics, Modeling/Design and many others.