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Event Overview:

DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities.

Taking place annually in Silicon Valley, DesignCon was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more.

DesignCon enables chip, board and systems designers, software developers and silicon manufacturers to:

Grow their design expertise
Learn about and see the latest advanced design technologies and tools from top vendors in the industry
Network with and gain inspiration from fellow engineers and design engineering experts

Attendee Information:

The DesignCon Technical Conference Program consists of 14 tracks covering all aspects of electronic design, from chips through boards and systems.

Through more than 100 technical paper sessions, panels and tutorials, conference attendees gather the latest theories, methodologies, applications and advanced design tools related to signal integrity, power integrity, jitter, crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components and more.

Expo Hall
DesignCon is even bigger this year, with the Expo floor featuring more exhibitors than ever before. Discover and evaluate the latest high-speed design tools, technologies and developments in the industry. And don’t miss your chance to network with and gain inspiration from fellow engineers and design engineering experts.

Meet with more than 160 elite vendors to discover and evaluate the latest technologies, gain insight into solving your chip, board & systems design issues, and connect with new and known industry contacts.

Exhibitor Information:

The chip, board and systems design community relies on DesignCon for the latest technologies and developments in the industry. It is the largest meeting of board designers, and is the ONLY event to address chip design engineers' chip/system/package challenges.

Exhibiting at DesignCon puts your company face-to-face with the community in an interactive setting that combines an Expo Hall, technical conference, and networking events. DesignCon is produced by the premier source for design and business intelligence in the industry, UBM, which also produces EDN, EE Times, Design News,, and EBN. This powerful combination translates into unrivaled marketing exposure and access to today's leading decision makers.

Not sure if you want to exhibit at or attend the DesignCon 2017? See the panels below to get the information you need to make an informed decision.

All information in Events In America is deemed to be accurate at the time we add it, and we take steps to verify all details and update our records when new information is provided, but as people, events and circumstances change, we caution users to independently confirm all information. and Events In America LLC make no guarantee of accuracy and assume no liability for inaccurate information.

Conference/Event Dates: 01/31/2017 - 02/02/2017
Classification: B2B
Primary Industry: Engineering
Other Industries: Architecture & Construction, Design Services, Engineering, Manufacturing, Software, Technology
Estimated Attendance: 4,700
Audience: Analog Engineers
Application Engineers
ASIC Design Engineers
CAD Engineers
CEOs, Chief Engineers, Architects, Scientists, Technologists, VPs/Directors of Hardware/Software Engineering, R&D, Engineering Managers
Component Engineers
Computer Engineers
Design Engineers
Development Engineers
Electrical Engineers
Field Application Engineers
Firmware Engineers
Hardware Engineers
Mechanical Engineers
Members of Technical Staff (MTS)
PCB Design Engineers
Principal Engineers
Product Engineers
R&D Engineers
Senior Design Engineers
Signal Integrity Engineers
Software Engineers
Staff Engineers
System Architects / Engineers
Technical Leaders
Test Engineers
Verification Engineers...and more!
Venue: Santa Clara Convention Center
Venue Phone: (800) 272-6822
Venue Type: Indoor - Convention Center
Number of Exhibitors:160+ (2016) (Previous Year)
Show Owner:UBM Tech
Show Manager:UBM Tech
Sponsorship: Yes

Booth Size Booth Cost   Available Amenities
Exhibiting & Sponsorship Opportunities Available Please Contact Kelsey Kisner for Additional Information   Electricity: Yes - Unknown Price
  Water: n/a
  Generator: n/a
  Marketing Vehicles Allowed: Yes
Other Booth Sizes Available: n/a

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